Principle Support Application Engineer
This Principal Support AE will provide direct and escalated technical support to design engineers using the Cadence Board Design products in the Silicon Package Board Domain which is a sub-domain of the Intelligent Systems Design space. The person would be expected to ramp up on the System Analysis domain which includes multi-disciplinary product flows from Cadence. These include the products like Sigrity Signal Integrity, Sigrity Power Integrity, Sigrity Power DC, Clarity, Celsius – Thermal Design Engineering tools and related technologies in the Digital and Custom IC design flows. This person will handle Board layout related issues like placement problem, routing completion, managing design constraints, front-to-back ECO (Engineering Change Order), back-annotation mismatch issues to name a few. The AE is also expected to handle queries in Board Simulation to enable the customer to get the correct results in simulation. The AE is expected to be expert on scripting – TCL/Tk and SKILL programming. Reviewing customer codes and providing suggestions to improve functionality and performance and debugging customer codes at times will be required. The principal AE will work with customers in a specialized program called the Expert-2-Expert where they will work with Subject Matter Experts (SMEs) at the customer side. The prospective AE is expected to operate independently, be a self starter and be proactive in ramping up junior AEs. He/She should be able to lead projects. They need to be culturally sensitive and aware so that they can deliver a great customer experience when dealing with global customers. They also interact with internal stakeholders to resolve customer issues like Order fulfillment and Licensing that is a key piece for customer satisfaction. The Principal Support Application Engineer will be working on Cadence tools like Allegro PCB Editor, Allegro Package Designer, Constraint Manger, Orbit IO, System-In-Package (SIP), Digital SIP and Allegro Engineering Design Management. Exposure to competitor’s equivalent product is an added advantage. The person should have solid experience of 8+ years with the Cadence product set outlined above. They must possess a Bachelor’s degree in Electronics engineering, preferably with specialization in VLSI. It is preferable to have Master’s degree with 6+ years to experience with Simulation products in the SPB domain. The person is expected to demonstrate a high level of communication skills, operate seamlessly in a globally dispersed and cross-cultural environment. They should be proficient in customer management, should have interacted with customers working in the high-tech industry. Experience of handling design issues would be a plus. Work experience on IC Packaging, System-in_Package (SIP) and packaging software would be preferred. The core responsibilities would also include: Advocate and negotiate bug/enhancement resolution with R&D. Develop/Review contents e.g. Rapid Adaption Kits, Videos, Application Notes, point solutions for publishing on Cadence Online Support portal. Lead internal technology roll out projects and training. Lead Project and initiatives related to Quality & Customer satisfaction. Email your cv to email@example.com. .
64 days ago